The market demand for environmentally friendly flux products is large.
Date：2019-10-18 Auto：
There are many potential demands in the Chinese market, so we must promote our products, including taking advantage of exhibition opportunities such as Shenzhen NEPCON (South China International Electronics Manufacturing Equipment and Microelectronics Industry Exhibition). In this exhibition, we will introduce the impact test of BGA (ball grid array package) solder balls and the linear reflow temperature curve of SN100C by video. At the same time, we will also show the brand-new completely halogen-free lead-free solder paste SN100CP600D4 and CoreSN100C(040).
From the recent global market situation, products need more environmental protection. In this regard, we are trying to expand our product line to provide completely halogen-free and VOC-free flux products.
The latest ePaste provided by Nihon is SN100CP600, which is a completely halogen-free SN100C(Sn-0.7Cu-0.05Ni+Ge) lead-free solder paste and does not contain f (fluorine), Cl (chlorine), Br (bromine) and I (iodine). It has high reliability, stable printing capability, outstanding humidification capability and non-melting shrinkage characteristics, and is suitable for high-density assembly.
P600 has outstanding melting characteristics, minimizing the number of solder balls and chip intermediate solder balls, providing stable printing capability and obvious cost advantages. This solder paste also reduces soldering aid residue and is an alloy (SN100C) with reliability and impact strength meeting the standard. since the peak reflow temperature is about 240℃, it allows the use of a temperature curve similar to SAC (lead-free solder tin silver copper).
SN100C(040) is the latest addition of eCore products. It is a highly reliable, completely halogen-free SN100C(Sn-0.7Cu-0.05Ni+Ge) lead-free solder aid solder wire, which does not contain F, Cl, Br and I. The solder wire has good tip isolation, reduces the number of icicle incidents and cracks in welding aid residues, reduces shrinkage defects, reduces copper corrosion, provides a stable intermetallic layer, and the solder wire also provides obvious cost advantages.
